We have several prototypes being built over the next few weeks and wanted to hide the chip numbers of some of the glue logic. We've sanded them off up to now, but that's an awful and time consuming way to do it. A search of the sci.electronics groups came up empty....amazingly.
Does anyone have any recommendations for covering up the numbers on plastic and ceramic DIP packages? Loctite's black Prism 410 adhesive looks good, but we're not sure if it will stick well enough or if it can be pried off like a "pancake".
Or is sanding still the best option for doing this?
Thanks!
John Muchow
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