I am working on a PCB design for our test site, which contains 100pads and more than ten RF circuits with more than 50 RF I/Os. We have 12 types of VDD and two types of GND on this chip. I am thinking about using a 6 layer board, signal, GND1, VDD, VDD, GND2, signal. However it will be very hard to assign the layer for VDDs and to route VDD lines. This board isfor a RF chip, so that transmission lines need to be created by the signal layer and GND layer. Please give me some advices on how many layer board I should design and what each layers are for. And will it be possible to run PSpice simulations for it after the design is done? Thanks.
Allen