The array processor I worked on used ducted fans to blow on a number of dev ices in parallel. The PCB used ECL gate arrays in LCC packages. Each one had an aluminum heat sink glued on top with radial fins sticking up into a tube from the cooling plenum. A single fan blew air into the plenum.
We couldn't run the machine with the board out of the plenum so probing the chips directly was not possible. The PCB had via holes the same diameter as the probe tips on our scopes so we could plug them in without the top ha t. Once in a while we would bump the probe and break the tip. They cost $
75 which was quite the dollar back then so management gave us some crap pro be that wouldn't work. We should have found a way to jury rig something.Rick C.