Back in the "good old daze" of MIL-SPEC, many ICs and discretes were also characterized and specified to work from -55C to 125C. Most of those same parts these days have been discontinued - more eXplicitly, the packages have been discontinued (Cerdip, Metal). But (for the most part) the processes making those chips has not changed. I have tested a number of the "plastic" (actually epoxy) parts to
180C, and have found no package problems. And, except for band-gap voltage references (and parts that use them), i have found no problems. On the low temp side, i remember doing "quick" testing of analog devices by using dry ice. No problems. Get some dry ice and test some parts. If you want a bath to help thermal transfer, use acetone.