Any issues with soldering to an RoHS-compliant module with ordinary
60/40 solder? ...Jim Thompson-- | James E.Thompson, CTO | mens | | Analog Innovations, Inc. | et | | Analog/Mixed-Signal ASIC's and Discrete Systems | manus | | Phoenix, Arizona 85048 Skype: Contacts Only | | | Voice:(480)460-2350 Fax: Available upon request | Brass Rat | | E-mail Icon at
Other than making it RoHS non-compliant?
I use 60/40 solder for prototyping, with a mix of RoHS and non-RoHs components. I haven't had problems -- but I haven't tried to get anything through environmental cert, either.
-- Tim Wescott Wescott Design Services http://www.wescottdesign.com Do you need to implement control loops in software? "Applied Control Theory for Embedded Systems" was written for you. See details at http://www.wescottdesign.com/actfes/actfes.html
This is for my extended G-job... no certification needed ;-) ...Jim Thompson
--
| James E.Thompson, CTO | mens |
| Analog Innovations, Inc. | et |
| Analog/Mixed-Signal ASIC's and Discrete Systems | manus |
| Phoenix, Arizona 85048 Skype: Contacts Only | |
| Voice:(480)460-2350 Fax: Available upon request | Brass Rat |
| E-mail Icon at http://www.analog-innovations.com | 1962 |
Remember: Once you go over the hill, you pick up speed
If you're talking a discrete 'module' then leading probably uses a matte tin plating, which shouldn't be a problem for tin/lead solder. Maybe need a bit more temp than with lead/tin plating to get good wetting, but less than needed for lead free solder.
BGAs are another matter since they, if RoHS compliant devices, will already have lead free solder bumps (often/usually SAC) and trying to mix those with a tin/lead solder profile can be problematic, because of the temperature mismatch, although solvable from what I hear.
60/40 for reliability, tin solder for compliance.
This is hand-work, thru-hole. Only BGA's I ever see are on paper as I figure out the wire-bonding/strap-welding ;-) ...Jim Thompson
--
| James E.Thompson, CTO | mens |
| Analog Innovations, Inc. | et |
| Analog/Mixed-Signal ASIC's and Discrete Systems | manus |
| Phoenix, Arizona 85048 Skype: Contacts Only | |
| Voice:(480)460-2350 Fax: Available upon request | Brass Rat |
| E-mail Icon at http://www.analog-innovations.com | 1962 |
Remember: Once you go over the hill, you pick up speed
I suspected as much but you didn't say, soooo...
We use ROHS BGAs with leaded and lead-free solder, and it all works fine. We prefer leaded solder of course, and use it on US aerospace stuff, but we do lead-free for our european customers, who are presumably less pickey about their airplanes falling out of the sky. At least they don't spread any lead around when they crash.
John
ROTFLOL
63/37 is the eutectic alloy. I've never noticed a difference in performance with 60/40, but I feel better about it. ;-)
Cheers! Rich
Oh, yes! Do a joint with a blob of solder with 60/40, and move it just before it solidifies. You will get something that looks like tiny cottage cheese, all sorts of crumbly chunks. Repeat with 63/37, and you will see a fuzzy-looking surface, but a much more solid joint. Assuming he 60/40 is really a 60/40 composition, and not eutectic with looser specs, the difference will be pretty obvious. But, nowadays, it may actually be impossible to get solder that is really 60/40, as everybody uses the eutectic alloy.
Jon
It's "Chemalloy" brand, dating from the mid-80's, labeled "60/40 Activated Rosin Core Solder". I have several 1lb spools of it ;-) ...Jim Thompson
--
| James E.Thompson, CTO | mens |
| Analog Innovations, Inc. | et |
| Analog/Mixed-Signal ASIC's and Discrete Systems | manus |
| Phoenix, Arizona 85048 Skype: Contacts Only | |
| Voice:(480)460-2350 Fax: Available upon request | Brass Rat |
| E-mail Icon at http://www.analog-innovations.com | 1962 |
Remember: Once you go over the hill, you pick up speed
The word for today is: Lattice
Probably more like they're more programmed for obedience than us rough- and-tumble American rebels. ;-)
True. But I do wonder what's the status of fluorescent lamps there. ;-)
Cheers! Rich
At ordinary operating temperatures, no problems. But SMT parts will tend to dislodge at temps 170C and higher; that is seen even if one starts with HASL PCB and uses tin-silver solder (paste or wire). ANY amount of tin-lead significantly lowers the MP.
At ordinary operating temperatures, no problems. But SMT parts will tend to dislodge at temps 170C and higher; that is seen even if one starts with HASL PCB and uses tin-silver solder (paste or wire). ANY amount of tin-lead significantly lowers the MP.
"Jim Thompson" wrote in message news: snipped-for-privacy@4ax.com...
I do it all (most) of the time.... no-one knows, no-one cares and no-one checks....
I thought telecom and aeronautics were exempt.
Does anything run at 170C, especially SMT?
-- Reply in group, but if emailing add one more zero, and remove the last word.
For what it's worth I try to add lead to lead free to make reworking easier, since lead seems to conduct heat better and the resulting solder join acts more like what I'm used to. Fortunately I'm still able to buy
60/40 solder and will continue to use that for repairs.I bought some leadfree solder in case I strike a situation where I must keep the lead out. Stuff acts differently in the heat. But I have the cheap tin + copper, not the expensive tin + silver type.
Grant.
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