>1. Manufacturing, Semiconductor Technology and Devices
> 1.1 Design for Manufacturability/Yield & Quality (DFM/DFY/DFQ)
> 1.2 Effects of Technology on IC Design, Performance, Reliability,
>and Yield (TRD)
>
>2. Electronic Design
> 2.1 System-level Design, Methodologies & Tools (SDM)
> 2.2 Package - Design Interactions & Co-Design (PDI)
> 2.3 Robust & Power-conscious Circuits & Systems (PCC)
> 2.4 Emerging/Innovative Process & Device Technologies and Design
>Issues (EDT)
> 2.5 Design of Reliable Circuits and Systems (DFR)
>
>3. Design Automation and CAD
> 3.1 EDA Methodologies, Tools, Flows & IP Cores; Interoperability
>and Reuse (EDA)
> 3.2 Design Verification and Design for Testability (DVFT)
> 3.3 Physical Design, Methodologies & Tools (PDM)
>
Dig those crazy acronyms!
Were they intentionally chosen for early obscurity or is this just simply ignorance?
Is this make-work or a publishing opportunity?
RL