LLP - Lead Less Package?

Datasheet:

Leadless Leadframe Package (LLP) Order Number DP83847 LQA56A NS Package Number LQA-56A

With the buried GND and VDD pads it looks impossible to do with just an iron.

If you have your own paste stenciler and IR or hot air station you could do it.

Interesingly the order of peripheral pins is opposite to convention. What possessed them to do that?

Regards,

Boris Mohar

Got Knock? - see: Viatrack Printed Circuit Designs (among other things)

void _-void-_ in the obvious place

CCW from the top seems normal to me.

Best regards, Spehro Pefhany

So salp me silly!. Dysexia strikes again. (:

If I _had_ to solder it, I would apply a little bit of solder to the inner pads, apply flux, align the part on top of the pads and use a heat-gun (aka paint stripper) to melt the solder. After that I would verify pad connections for shorts (it is a good idea to have test points to every inner pad).

If it's not too late, change to the DP83848. It's cheaper, better (lower power, auto-MDIX), and comes in a 48-pin LQFP package.

If it *is* too late, then you have my condolences - we used one on a prototype once, and it was not easy to solder (and I never actually tested it to see if it worked).

It's not to late. I just saw it at farnell. And as it was 3x cheaper than other models. I thought I might look into it. But it seems a mess to deal with.

Yeah, the package isn't the best..

I found your suggested chip at 6.18 USD/Digichip. Not clear on what to chose but LLP it won't be as of now.

Search the web for soldering BGAs using a toaster oven. What a horrible package! Don't use too much paste for the center pad or you will get a blobacious mess. Other options are find another part (these come in TQFP packages from other manufacturers) or have a regular assembly house solder the part for you.

Yep. Those "blobacious" messes are the worst ;-)

...Jim Thompson