High current pcb

The i7 (6 core) has a TDP of 130W. The core temperatures _rapidly_ shoot up when you give it something significant to do.

Assume heat dissipation at the center is zero (fair for an infinnitessimal segment, blatantly false for an infinite number of them). If heat diffuses through copper out to infinity, temperature drops inversely with distance (because cross sectional area increases linearly). It looks like a point charge in space, and the temperature is defined by Gauss' law.

temperature-dependent coefficients besides. So it's not at all true that, the device itself, and the little bit of copper surrounding it that doesn't have a quite circular temperature profile, isn't dissipating any power. In fact, it could be dissipating a considerable amount of power. If the heat source were an infinnitessimal point, it would have infinite temperature, and therefore radiate infinite power density (power can still be finite, since the area is infinnitessimal).

power dissipation is just a little higher in the center, and spreads out in a slightly-steeper-than-inverse relationship, eventually going to zero at infinity all the same. The trouble is deriving the exponent and coefficient of that power law.

Q6600 is 105W, I got one :)

Grant.

They do some fancy power saving plus (over) clocking on-chip to improve windoze performance? Measure temp on chip in places and go fast as they can in the current (!) circumstance.

Grant.

The original dual core G5 sucked up 130W at 1.25V. That was five years ago.

The big boss had a codename that chip contest, which I won with the codename "Antares", with the series theme "Bright Stars". He made the comment in an email that he hoped it wasn't a comment about the power density. I replied (in an email) that the dual-core G5 had a power density of 1E9 times that of Sol. ANother time I didn't make any points. ;-)

Not a big surprise. Just the same a lot of power goes to the 1.8 V to

Assume heat dissipation at the center is zero (fair for an infinnitessimal segment, blatantly false for an infinite number of them). If heat diffuses through copper out to infinity, temperature drops inversely with distance (because cross sectional area increases linearly). It looks like a point charge in space, and the temperature is defined by Gauss' law.

temperature-dependent coefficients besides. So it's not at all true that, the device itself, and the little bit of copper surrounding it that doesn't have a quite circular temperature profile, isn't dissipating any power. In fact, it could be dissipating a considerable amount of power. If the heat source were an infinnitessimal point, it would have infinite temperature, and therefore radiate infinite power density (power can still be finite, since the area is infinnitessimal).

the power dissipation is just a little higher in the center, and spreads out in a slightly-steeper-than-inverse relationship, eventually going to zero at infinity all the same. The trouble is deriving the exponent and coefficient of that power law.

Does it take the rather typical 3 or 4 supply voltages at various currents? A lot of the high power is getting on/off chip (high speed busses).

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Assume heat dissipation at the center is zero (fair for an infinnitessimal segment, blatantly false for an infinite number of them). If heat diffuses through copper out to infinity, temperature drops inversely with distance (because cross sectional area increases linearly). It looks like a point charge in space, and the temperature is defined by Gauss' law.

temperature-dependent coefficients besides. So it's not at all true that, the device itself, and the little bit of copper surrounding it that doesn't have a quite circular temperature profile, isn't dissipating any power. In fact, it could be dissipating a considerable amount of power. If the heat source were an infinnitessimal point, it would have infinite temperature, and therefore radiate infinite power density (power can still be finite, since the area is infinnitessimal).

the power dissipation is just a little higher in the center, and spreads out in a slightly-steeper-than-inverse relationship, eventually going to zero at infinity all the same. The trouble is deriving the exponent and coefficient of that power law.

I'm sure you can go find and read the specs as easily as I can.

Grant.

Hello,

did you calculate the power density per surface area of the chip, or per volume of the chip?

Bye

Volume.

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chicken). Assume heat dissipation at the center is zero (fair for an infinnitessimal segment, blatantly false for an infinite number of them). If heat diffuses through copper out to infinity, temperature drops inversely with distance (because cross sectional area increases linearly). It looks like a point charge in space, and the temperature is defined by Gauss' law.

temperature-dependent coefficients besides. So it's not at all true that, the device itself, and the little bit of copper surrounding it that doesn't have a quite circular temperature profile, isn't dissipating any power. In fact, it could be dissipating a considerable amount of power. If the heat source were an infinnitessimal point, it would have infinite temperature, and therefore radiate infinite power density (power can still be finite, since the area is infinnitessimal).

the power dissipation is just a little higher in the center, and spreads out in a slightly-steeper-than-inverse relationship, eventually going to zero at infinity all the same. The trouble is deriving the exponent and coefficient of that power law.

Oops, my bad. I guessed from the way you were talking you already had the datasheet and knew already.

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chicken). Assume heat dissipation at the center is zero (fair for an infinnitessimal segment, blatantly false for an infinite number of them). If heat diffuses through copper out to infinity, temperature drops inversely with distance (because cross sectional area increases linearly). It looks like a point charge in space, and the temperature is defined by Gauss' law.

temperature-dependent coefficients besides. So it's not at all true that, the device itself, and the little bit of copper surrounding it that doesn't have a quite circular temperature profile, isn't dissipating any power. In fact, it could be dissipating a considerable amount of power. If the heat source were an infinnitessimal point, it would have infinite temperature, and therefore radiate infinite power density (power can still be finite, since the area is infinnitessimal).

the power dissipation is just a little higher in the center, and spreads out in a slightly-steeper-than-inverse relationship, eventually going to zero at infinity all the same. The trouble is deriving the exponent and coefficient of that power law.

Nah, I read from the other PoV, some regulator chip datasheets for the CPUs' power supply, but long enough ago to forget the details ;)

Those CPUs have nasty power requirements, stop, start ~100A and don't dare produce any glitches!

Grant.

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chicken). Assume heat dissipation at the center is zero (fair for an infinnitessimal segment, blatantly false for an infinite number of them). If heat diffuses through copper out to infinity, temperature drops inversely with distance (because cross sectional area increases linearly). It looks like a point charge in space, and the temperature is defined by Gauss' law.

temperature-dependent coefficients besides. So it's not at all true that, the device itself, and the little bit of copper surrounding it that doesn't have a quite circular temperature profile, isn't dissipating any power. In fact, it could be dissipating a considerable amount of power. If the heat source were an infinnitessimal point, it would have infinite temperature, and therefore radiate infinite power density (power can still be finite, since the area is infinnitessimal).

maybe the power dissipation is just a little higher in the center, and spreads out in a slightly-steeper-than-inverse relationship, eventually going to zero at infinity all the same. The trouble is deriving the exponent and coefficient of that power law.

Between those and the nutty power requiurements for some of the bigger faster FPGAS, pretty well forced the development of low voltage, polyphase, synchronously rectified, switching power supplies and controller chips.