On a sunny day (Sat, 19 Nov 2011 18:14:43 -0800 (PST)) it happened " snipped-for-privacy@fonz.dk" wrote in :
Yes is easier to solder, but it needs an external diode, the tps61200 uses a synchronous rectifier, so is more efficient by design, and can also do more output current.
On a sunny day (Sat, 19 Nov 2011 16:18:24 -0600) it happened John S wrote in :
designed it.
Maybe, I wear 2 glasses on top of each other doing things like that. But I would indeed prefer a more human visible package.
First ofcourse you'll need a PCB. When creating the footprint you must make sure the pads extend about 1mm beyond the package. For the 'pin' underneath the device you need to put vias in the pad.
When soldering the device you'll need a fine tip to attach 2 pins. After that apply flux and use a bigger tip to solder the rest. You don't have to aim at a specific pin. The flux will take care of preventing shorts. For soldering the pad underneath you'll need a big tip. Apply flux in the vias and let solder flow into one or two vias. Now keep the soldering tip on the PCB until you see the solder coming up in the other vias. Now the pad underneath is soldered as well.
Here are somepictures:
designed it.
yes it does...
jamie
designed it.
Yes, excellent idea ! Thanks !
Luckily, we do our own IR at work so if I have a PCB, that would be a bit easier but for prototyping without a paste mask, the "hole" idea would work.
boB
boB a écrit :
designed it.
No need of big vias... Normal ones and flux are enough, at least for the small packages.
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