Epoxy filled with micro spheres for thickness control.
I'm sticking conductive surfaces together and I'd like thermal contact, but no electrical. The bottom piece is a pcb double sided "ground plane" with PTH, the top will be samples pieces, Semiconductors and metals. The samples will be ~ 1 cm^2. I was thinking that epoxy filled with ~100 sphere's per cm^2 (when spread one sphere high) would be about right. But I have no idea, And I'm just looking for any wisdom. Has anyone done this??
Well at least master bond
Thanks, George H.