Vias carry the copper from 'plating-up'. For 1oz that's 1/2oz stock plated up to 1oz - so 1/2oz in the PTHs.
Vendors prefer not to have to plate up more than an ounce above the base material, in any one operation. Buried vias may be 1/2oz inside the prepreg, with through-holes showing extra plating from subsequent operations, that differs with each layer, depending on the number of plating steps it's experienced.
Vias aren't especially reliable, as a component of the board alone. They also suffer from stress in subsequent fab steps. MTBF calculations require via or PTH counts, though this anticipates solderable joint issues as well.
RL