Hi
We are running 25A in copper traces in a frequency inverter.
I have reduced the power dissipation of the traces by increasing the copper thickness from 70u to 105u and increased the widht of the traces
We are still experiencing to high temperatures from the trace dissipation
We could go to 6 layer PCB, or we could remove the soldermask to add tin to the copper traces on the bottom layer (from the solderwave process)
But, any other ways?
Perhaps someone has experience in adding a leadframe to the PCB to handle the low frequency currents?
Regards
Klaus