I designed a board that has copper fills with .005" clearance between fill, and copper pads and traces. When built up many of these boards worked, but many others have shorts from 5V power to GND that are difficult or impossible to find. I suspect strongly that .005" clearance is not sufficient and so there are hard to see places where solder is bridging from pad to fill. I suspect most especially all the through hole parts, and including under the plastic barrel of the Keystone 5010 test points.
Now I am redesigning the board for the next builds and I am increasing clearances. Please tell me what is a commonly used clearance that will greatly reduce the odds of such solder bridges occurring.
I have already redesigned the test point pads to have a clearance that exceeds the 5010's plastic barrel's diameter so I can have visual confirmation there is no short there, and greatly reducing the odds of there being one there as well.