Dear all,
I have a copper ribbon of about 4 mils in thickness and is coated with a layer of tin. Can any one suggest me of easy method or solution of cleaning the wire from oxides. I mean cleaning the tin oxide.
Thanks, Ganesh
Dear all,
I have a copper ribbon of about 4 mils in thickness and is coated with a layer of tin. Can any one suggest me of easy method or solution of cleaning the wire from oxides. I mean cleaning the tin oxide.
Thanks, Ganesh
Great,
But I forgot to mention that I need to wrap the ribbon around the solder wire and do the solder dip. I just checked that plumber flux might be not a good option if I am going for soldering. Is there any other way of cleaning? Will try with vinegar though.
Thanks again, Ganesh.
I would try Tarnex. Works great, smells bad.
What exactly are you trying to accomplish?
The tin oxide is there to protect the assembly from corrosion. (that's why they use tin - the layer of oxide is hard to just scrape off, and doesn't react very well with much of anything after it's in place, but will still let you solder, if you have good flux.)
If all you're trying to do is solder to the piece of tin-plated (with oxide layer) copper, then let the flux into which you dip the assembly before dipping into the solder pot do the cleaning when you dip it. That's what flux is for. You don't need aggressive acid plumbing flux - just dippable liquid solder pot flux.
You _do_ have to skim the slag so you have a nice bright shiny solder surface in the pot before you dip the flux-dipped component. An aluminum scraper works well here - aluminum oxide is practically inert, and so won't contaminate your solder.
In case I wasn't clear here - you have two pots: one with liquid flux, that you dip the assembly into to wet it, and the other with the molten solder.
It will probably be a good idea to physically clean the parts, like with a wire brush or steel wool, to get the biggest particles off.
Good Luck! Rich
Dear Rich,
I really appriciate your advices and tips. We do dip the wire in the flux and preheat it before solder dipping. But we have a problem of void formation after the dip and I believe the main reason being the oxide formation/ contamination on the surface and hence was curious to know if there are any method of scrapping of the oxide layer. Also for the contamination we do clean the surface with IP before hot dip. So the only chance might be because of oxidation. More advices and tips are most welcome.
Thanks again, Ganesh.
I think ammonia removes most oxides from most metals.
--Mac
An aggresive flux may do it ( such as plumbers flux ). Clean off any residue before using for electronic use.
Otherwise it's acids I guess. Tried vinegar ? It might work.
Graham
I'm sorry, Ganesh, but I've given you pretty much all I've got, without being on-site to physically inspect what the cause of the voids is.
At this point, my best guess is little hidden nooks and crannies where oxide is hiding, or something like that.
Other than that, practice, practice, practice! :-)
Good Luck! Rich
Thanks Rich .. Seems no other way than... the Hard way :) ..
ganesh..
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