Does anyone know the step-by-step procedures, alloys and temperatures involved from die attach (to a leadframe) to glass frit seal in the cerdip package (or similar)?
- posted
17 years ago
Cerdip and other die attach
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- posted
17 years ago
From what i can google quickly the solder to the leadframe varies quite a bit and has melting temps from about 275C to over 600C. The glass frit seal seems to go off between 500C and 1200C. The later is probably not suitable for semiconductor use.
-- JosephKK Gegen dummheit kampfen die Gotter Selbst, vergebens. --Schiller
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- posted
17 years ago
You found a lot more than i was able to find; thanks.