Does anybody have any suggestions for good books to help with the process of physically laying out a board, especially for non-RF applications ? I know there are good app notes from IC manufacturers for high speed circuit layout, and I've read a bunch of them over the years, but I'm looking for guidelines like:
board materials and thicknesses trace widths and trace separation how wide and thick a trace needs to be for a given current what all the different layers really mean to the manufacturing process what all the output files mean in the manufacturing process types of vias copper thicknesses layer organization tips techniques for reducing board manufacturing costs