I have a situation where I want to do a wire bond onto a copper trace on FR4. Direct bonding to copper isn't as reliable as a bond to nickel gold. What are my other options?
I want a nonmagnetic noncorroding surface on all of the traces and to wire bond in one place and solder in another.
This might be of interest:
Interesting but not really what I need in this case.
I like the idea of doing direct chip on board as a way to push down the size on power things but not have to spend huge amounts on the NRE.
interest:
Gold plated FR4 is not that much more expensive. What NRE?
There *is* a solution to this requirement--I know someone who's done it, reliably. Alas, I don't remember what he did, or if it's proprietary.
Maybe Google chip-on-board stuff?
James Arthur
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The gold plating was not the case that would cost the large NRE. In my original post, I was asking about something that has nothing to do with this comment about the link provided.
The nickel is the problem I am trying to solve right now.
I have googled on that and other things and have found lots of sites with various alternatives. Going directly down on the copper looks like a poor option. Silver with magic organic compound looks ok. I was hoping for a great success story from one of the members of the group.
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