I'd guess that they won't be very good as regards heat sharing. The transistors appear to be physically separated, in a linear pattern even, and the DI thing can't help any. The silicon thermal conductivity is moderated by the wafer-type silicon being very thin.
The best opamp front ends tangle the transistors physically so that they appear to be tightly thermally coupled, even when the dissipations aren't balanced. It think the old MAT-XX parts did that too.
Here's a UPA800, dissipating 80 mW on one transistor...
ftp://jjlarkin.lmi.net/UPA800_80mW_one-side.jpg
John