2SD1819A wafer / die size?

The die pad dimension for standard commercial SC70/SOT323 part bodies is 34x28mils.

Maximum recommended die size on this pad is either 30x20mils or

The lower, more common limit on a copper lead frame, chip-down, achieves a thermal impedance of roughly 280degC/W (double-sided JEDEC pcb) or 416degC/W (single-sided JEDEC pcb).

As the 2SD1819A is registered to Panasonic/Matsushita, they are likely the only source for current information, likely published only if the unackaged dice are offered discretely.

If you currently own one of these parts, there's nothing stopping you from breaking the body open and measuring the dimension yourself.

RL

If you're going to buy it in die form, say for hybrid assembly, the foundry will tell you. If you're just fishing to estimate die cost... fat chance ;-)

...Jim Thompson

-- | James E.Thompson, P.E. | mens | | Analog Innovations, Inc. | et | | Analog/Mixed-Signal ASIC's and Discrete Systems | manus | | Phoenix, Arizona Voice:(480)460-2350 | | | E-mail Address at Website Fax:(480)460-2142 | Brass Rat | |

Thanks for the replies guys. That gives me an approx figure that I wanted. regards, JEFF

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