Texas Instruments MSP430 datasheet: Package option addendum

PACKAGE OPTION ADDENDUM

www.ti.com 14-Jun-2026

PACKAGING INFORMATION

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(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

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TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

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(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF MSP430G2453, MSP430G2553 :

• Automotive : MSP430G2453-Q1, MSP430G2553-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

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PACKAGE MATERIALS INFORMATION

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TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

*All dimensions are nominal

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TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

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TUBE

*All dimensions are nominal

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PACKAGE OUTLINE

PW0020A

TSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

6.6 TYP 6.2 PIN 1 INDEX AREA 18X 0.65 20 2X 5.85 6.6 6.4 NOTE 3 10 B 4.5 4.3 NOTE 4 11 20X +0.30 / -0.19 ⌖ 0.1 M C A B C SEATING PLANE ⌒ 0.1 C 1.2 MAX (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.05 0.75 0.50 0°-8° DETAIL A TYPICAL

4220206/A 02/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

TEXAS INSTRUMENTS

EXAMPLE BOARD LAYOUT

PW0020A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X

SOLDER MASK DETAILS

4220206/A 02/2017

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

TEXAS INSTRUMENTS

EXAMPLE STENCIL DESIGN

PW0020A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE

4220206/A 02/2017

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
9. Board assembly site may have different recommendations for stencil design.

TEXAS INSTRUMENTS

GENERIC PACKAGE VIEW

RHB 32

5 x 5, 0.5 mm pitch

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details.

4224745/A

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PACKAGE OUTLINE

RHB0032E

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

A 5.1 4.9 B PIN 1 INDEX AREA 5.1 4.9 (0.1) SIDE WALL DETAIL OPTIONAL METAL THICKNESS

1 MAX 0.05 0.00 C SEATING PLANE 0.08 C 2X 3.5 □ 3.45± 0.1 9 16 EXPOSED THERMAL PAD (0.2) TYP 28X 0.5 8 17 SEE SIDE WALL DETAIL 2X 3.5 33 SYMM 32X 0.3 0.2 0.1 M C A B 0.05 M C 1 24 32 25 PIN 1 ID (OPTIONAL) SYMM 32X 0.5 0.3

4223442/B 08/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

TEXAS INSTRUMENTS

EXAMPLE BOARD LAYOUT

RHB0032E

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(□3.45) SYMM 32 25 32X (0.6) 1 32X (0.25) 28X (0.5) (Ø 0.2) TYP VIA 8 (R0.05) TYP 24 (1.475) 33 SYMM (4.8) 17 9 (1.475) 16 (4.8)

LAND PATTERN EXAMPLE SCALE:18X

0.07 MAX ALL AROUND METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED)

0.07 MIN ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

SOLDER MASK DETAILS

4223442/B 08/2019

NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented.

TEXAS INSTRUMENTS

EXAMPLE STENCIL DESIGN

RHB0032E VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD

4X (□ 1.49) (0.845) (R0.05) TYP 32 25 32X (0.6) 1 32X (0.25) 28X (0.5) 24 (0.845) SYMM 33 (4.8) 8 17 METAL TYP 9 SYMM 16 (4.8)

SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 33: 75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X

4223442/B 08/2019

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

TEXAS INSTRUMENTS

MECHANICAL DATA

N (R-PDIP-T**)

16 PINS SHOWN

PLASTIC DUAL-IN-LINE PACKAGE

NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. △C Falls within JEDEC MS-001, except 18 and 20 pin minimum body length (Dim A). △D The 20 pin end lead shoulder width is a vendor option, either half or full width.

4040049/E 12/2002

TEXAS INSTRUMENTS

MECHANICAL DATA

PW (R-PDSO-G28) PLASTIC SMALL OUTLINE

4040064-7/G 02/11

NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. C. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0,15 each side. D. Body width does not include interlead flash. Interlead flash shall not exceed 0,25 each side. E. Falls within JEDEC MO-153

TEXAS INSTRUMENTS

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