National Semiconductor LM324 datasheet: Package materials information

PACKAGE MATERIALS INFORMATION

9-Oct-2026

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

All dimensions are nominal

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

9-Oct-2026

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

9-Oct-2026

Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION

9-Oct-2026

TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

Pack Materials-Page 4

PACKAGE MATERIALS INFORMATION

9-Oct-2026

Pack Materials-Page 5

PACKAGE MATERIALS INFORMATION

9-Oct-2026

TUBE

*All dimensions are nominal

Pack Materials-Page 6

PACKAGE MATERIALS INFORMATION

9-Oct-2026

Pack Materials-Page 7

MECHANICAL DATA

W (R-GDFP-F14) CERAMIC DUAL FLATPACK

NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a ceramic lid using glass frit. D. Index point is provided on cap for terminal identification only. E. Falls within MIL STD 1835 GDFP1-F14

4040180-2/F 04/14

PACKAGE OUTLINE

DB0014A

SSOP - 2 mm max height

SMALL OUTLINE PACKAGE

8.2 TYP 7.4 PIN 1 INDEX AREA A 1 6.5 5.9 NOTE 3 7 B 5.6 5.0 NOTE 4 14 12X 0.65 2X 3.9 8 14X 0.38 0.22 0.15 M C A B C ⌒ 0.1 C SEATING PLANE 0.25 0.09 SEE DETAIL A 0.25 GAGE PLANE 0°-8° 0.95 0.55 2 MAX 0.05 MIN DETAIL A TYPICAL 4220762/A 05/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.
4. Reference JEDEC registration MO-150.

EXAMPLE BOARD LAYOUT

DB0014A SSOP - 2 mm max height SMALL OUTLINE PACKAGE

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X

SOLDER MASK DETAILS

4220762/A 05/2024

NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

EXAMPLE STENCIL DESIGN

DB0014A SSOP - 2 mm max height SMALL OUTLINE PACKAGE

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
8. Board assembly site may have different recommendations for stencil design.

4220762/A 05/2024

GENERIC PACKAGE VIEW

FK 20

8.89 x 8.89, 1.27 mm pitch

LCCC - 2.03 mm max height

LEADLESS CERAMIC CHIP CARRIER

This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details.

4229370/VAI

TEXAS INSTRUMENTS

GENERIC PACKAGE VIEW

J 14 CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE

Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details.

4040083-5/G

PACKAGE OUTLINE

CDIP - 5.08 mm max height

CERAMIC DUAL IN LINE PACKAGE

NOTES:

1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.

EXAMPLE BOARD LAYOUT

J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE

SEE DETAIL A (.300 ) TYP [7.62] 1 14 12X (.100 ) [2.54] 14X (∅.039) [1] SYMM 7 8 SYMM SEE DETAIL B

LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X

• 002 MAX [0.05] ALL AROUND (R.002 ) TYP [0.05] (.063) [1.6] SOLDER MASK OPENING METAL DETAIL A SCALE: 15X

METAL (∅.063) [1.6] SOLDER MASK OPENING

• 002 MAX [0.05] ALL AROUND DETAIL B 13X, SCALE: 15X

4214771/A 05/2017

TEXAS INSTRUMENTS

MECHANICAL DATA

N (R-PDIP-T**)

16 PINS SHOWN

PLASTIC DUAL-IN-LINE PACKAGE

NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001, except 18 and 20 pin minimum body length (Dim A). D. The 20 pin end lead shoulder width is a vendor option, either half or full width.

4040049/E 12/2002

PACKAGE OUTLINE

PW0014A

TSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

EXAMPLE BOARD LAYOUT

PW0014A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X

SOLDER MASK DETAILS

4220202/B 12/2023

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

EXAMPLE STENCIL DESIGN

PW0014A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE

4220202/B 12/2023

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
9. Board assembly site may have different recommendations for stencil design.

GENERIC PACKAGE VIEW

RTE 16

3 x 3, 0.5 mm pitch

WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD

This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details.

4225944/A

TEXAS INSTRUMENTS

PACKAGE OUTLINE

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

SIDE WALL METAL THICKNESS DIM A

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

EXAMPLE BOARD LAYOUT

RTE0016C

WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X

SOLDER MASK DETAILS

4219117/B 04/2022

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented.

EXAMPLE STENCIL DESIGN

RTE0016C WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD

4219117/B 04/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

D0014A

PACKAGE OUTLINE

SOIC - 1.75 mm max height

SMALL OUTLINE INTEGRATED CIRCUIT

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.

EXAMPLE BOARD LAYOUT

D0014A

SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT

LAND PATTERN EXAMPLE SCALE:8X

SOLDER MASK DETAILS

4220718/A 09/2016

NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

EXAMPLE STENCIL DESIGN

D0014A

SOIC - 1.75 mm max height

SMALL OUTLINE INTEGRATED CIRCUIT

14X (1.55) 1 14X (0.6) 12X (1.27) SYMM 14 SYMM 7 8 (5.4)

SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:8X

4220718/A 09/2016

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
9. Board assembly site may have different recommendations for stencil design.

MECHANICAL DATA

NS (R-PDSO-G**)

14-PINS SHOWN

PLASTIC SMALL-OUTLINE PACKAGE

4040062/C 03/03

NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15.

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