Hi
I am involved in a high reliability application where the device we want to use (Quicklogic EclipsePlus QL7160) is only available in a
208pin plastic PQFP (30mm sq) or 280pin plastic BGA (17mm sq). The environment will subject the device to elevated temperature (~115deg) and vibration (TBD). Has anyone any experience with using these types of devices in such an environment & what kind of measures can be taken to improve mechanical reliability ?Also, does anyone have any general comments on Quicklogic devices and/ or support ?
Thanks Dave