Can through hole parts be used with the stencil/solder paste/bake technique?
I'd like to possibly do a combination of smd and thru hole. (haven't done it yet).
I thought that if you can form and precut the leads (and maybe dip in a bit of paste ?) before placing on a pad with paste, it sounds like it may work?
or maybe you don't have to dip in paste first?
I thought also, if you kept the board level and suspended it in air while placing parts and baking, maybe you could cut the leads after being soldered?
Thanks for any info.