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Thermal Design: Heatsink for partly ducted 200LFM...

I'm in need for a heat sink for a cPCI 6U board experiencing ~200LFM air flow. We're talking an approximately 15cm wide and 9cm deep profile with a height of ~9.7mm.

Having given up finding standard extrusions I'm thinking of having a custom one made... Now, however, I'm in over my neck as I can't find any suitable literature on the subject. My primary concern is fin spacing/thickness. My guess is the spacing should not be much smaller than 2mm to avoid excessive bypass. Base thicknes is another issue.

I'd like to get a (close to) optimal profile in the first shot.... Can anyone recommend literature or something? I know multiple software packages are available - but I've also seen some prices on those!!! :-(

Cheers, Anders

Reply to
Anders F
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Your question is a little vague. Do you mean to slap a heatsink across the entire back face of the board? What's the heat dissipation power and distribution like?

And, given the jillions of standard heatsinks available, it's surprising thay you'd have to extrude your own.

John

Reply to
John Larkin

Or maybe a more suitable newsgroup?

Happy New Year =) Anders

Reply to
Anders F

custom

excessive

If anyone (besides me) follows this thread they might find something usefull on:

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This free calculator would be fine if it could handle bypass:
formatting link

Cheers, Anders

Reply to
Anders F

'Thermal

surprising

Thanks for the laugh. Happy New Year. gg

Reply to
stratus46

'Thermal

surprising

Reply to
stratus46

I read in sci.electronics.design that John Larkin wrote (in ) about 'Thermal Design: Heatsink for partly ducted 200LFM...', on Thu, 30 Dec 2004:

Not jillions. We defined the jillion back in 1962, for the benefit of the Sales Department, as '10^j' - a purely imaginary number.

--
Regards, John Woodgate, OOO - Own Opinions Only. 
The good news is that nothing is compulsory.
The bad news is that everything is prohibited.
http://www.jmwa.demon.co.uk Also see http://www.isce.org.uk
Reply to
John Woodgate

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