I'm in need for a heat sink for a cPCI 6U board experiencing ~200LFM air flow. We're talking an approximately 15cm wide and 9cm deep profile with a height of ~9.7mm.
Having given up finding standard extrusions I'm thinking of having a custom one made... Now, however, I'm in over my neck as I can't find any suitable literature on the subject. My primary concern is fin spacing/thickness. My guess is the spacing should not be much smaller than 2mm to avoid excessive bypass. Base thicknes is another issue.
I'd like to get a (close to) optimal profile in the first shot.... Can anyone recommend literature or something? I know multiple software packages are available - but I've also seen some prices on those!!! :-(
Cheers, Anders