As long as what's left fills in the cracks in the aluminum and copper, it should work. I would be worried if the gold dissolved into the aluminum or copper, but an amalgam (alloy) of gold and these two materials, it should not shrink much. As I previously mumbled, I haven't done much with the gold leaf and it's on my things to do list. Besides, if there's any questions as to the expected results, I prefer to see my own failures. Learn by Destroying(tm).
Good. I'll add it to my short list. If it works, management can then declare it too expensive, leaving me with what I originally wanted to use as the winner. (red herring).
True, but ignoring the operating temperatures, comparing the thermal resistances of the quilted indium foil with my tinkering is all I wanted.
Please note that my testing of thermal pastes and assembly methods were not exactly an organized project. I was trying to solve output power variability problems in production as well as squeeze a few more watts out of the available components to score a few points with marketing. It was by no means an organized effort and was spread over about 5 years of development on multiple products. Testing was resumed many years later when I entered the computer repair biz, and once again ran into the mysticism and magic that seems to surround thermal management.