There is a site called "stencils unlimited" that offers an inviting DIY procedure for doing your own SMD and reflow boards.
Up till now, it's all been hole-through for me and an occasional tweezer job with an smd part.
They provide you with a stainless steel stencil for laying down the paste (I've done alot of screen printing, so no problem there)....and the board is put in a toaster oven.
Although, I imagine the kitchen oven would work just as well.
My question is this...
When you reflow a board, do you make damn sure that EVERY part is mounted first? SMD and all hole through?
Or can you actually just paste the SMD parts only, let it cool and do the through hole parts later?
Or do the holes clog up from the reflow process preventing the through hole mounting?
Question 2.....
Assuming you do have to mount everything first, does the reflow process actually solder the through hole parts perfectly in place as well? Or do you have to go back and hit them with a hand soldering iron again?
THANKS