Hi:
As I understand, Ag and Au may be leached from surfaces when using standard Sn63Pb37 and Sn60Pb40 type electronic solders.
Why is this to be avoided? Does it result in "intermetallic compounds" near the interface that compromise mechanical properties?
Is this enough of a concern that typical gold plated component leads and silver plated hook-up wire in general shouldn't be soldered with tin-lead, but rather some non-leaching solders such as indium lead alloys for gold, or SnPbAg alloys for silver platings?
Or is it only relevant to specialized applications that place substantial mechanical stress or thermal fatigue cycles on soldered joints?
What is the difference between the issues involved in soldering Ag and Au platings, versus thick or solid Ag or Au surfaces?
Thanks for input.
Good day!