Why did the electronics industry move to SAC,when the MP is greater than simple tin/silver?
Seems some like nickel, some LOVE gold so combine them for "better" (ENIG). Would you believe that gold can accelerate corrosion, especially over time?
In our application, temperatures can get to 204C/400F which "helps" the corrosion mechanisms. More specifically, the dis-similar metal interface between the pad surface and the regrettable use of SAC.
We started with the use of Kester Sn06.3/Ag3.7 solder; we understand that Kester now says that they never made it (have physical proof they did). Its melting point is a bit lower than SAC, the electronics industry raised a big fuss when RoHS was instituted due to the higher processing temperature for soldering. We fail to understand why they chose the higher temp SAC which is less compatible with the chemistry of immersion silver. The copper adds no benefit.