Use lots of flux and put a large dab of solder on the iron tip. Then hold the pack in place with tweezers on one end and wipe the tip across 2 of the pads on the other end (same side). Solder the other pads the go back and clean up with a wick and more flux. Rest your hand or arm on something while you are holding the tweezers/part. Get a couple of those wrist pads for use with a mouse or just take a small bag and fill with rice.
I habitually attach 0402s using hot air and solder paste. The secret is low flow and air at 90 degrees to the PCB.
We had a device which places the PCB over the top of a slow flow hot stream to pre-heat the board, and the top side removal is far easier when the heat gets applied there.
Reflow processes would likely also be a bit smoother, as long as there are no bottom side parts to worry about.
Yup, just did an experiment with a hot air gun and a 44 pin LQFP. Wanted to fly away too. If you can tack a few pins, the surface tension of the solder will keep the chip from going airborn. Which will allow the chip to self center once you get solder flow. (And like Fred says, air is 90 degrees to the board)
Cheers
Have something to add? Share your thoughts — no account required.
Ask the community — no account required