Reflow.
? A 60W Hakko works ok here for through-hole, perhaps the 2oz I ordered isn't?
Reflow.
? A 60W Hakko works ok here for through-hole, perhaps the 2oz I ordered isn't?
One of the boards I'm working on now has four layers of 4oz and two
2oz. There are a few places that it takes a huge iron but not too bad. Of course the devices (e.g SON power FETs) that are really using the planes for dissipation are a PITA to remove. It's mostly SMT, so normal devices are no problem.
Yep.
Ugh? Copper is beautiful, especially moving big amps. Not ugh(ly)!
I reflowed the custom 3x12x30mm bus bar onto the proto with an ordinary Hakko--it was easy. I tinned both surfaces, then warmed up the bar. The heat spread wonderfully well. Copper's magic. I even moved it a few times with the same technique.
Now had the parts been soldered on the bar, that would've been tricky.
High current modules, such as 6 pulse rectifier stacks usually have screw terminals.
I guess that you might save something in the assembly work, by connecting the device with a few screws to a PCB, instead of manually preparing some wire harnesses and then install these to the device.
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