Texas Instruments TL431 datasheet: Package materials information

PACKAGE MATERIALS INFORMATION

10-Aug-2026

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

*All dimensions are nominal

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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PACKAGE MATERIALS INFORMATION

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TUBE

*All dimensions are nominal

Pack Materials-Page 13

PACKAGE OUTLINE

DBZ0003A

SOT-23 - 1.12 mm max height

SMALL OUTLINE TRANSISTOR

4214838/F 08/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side

TEXAS INSTRUMENTS

EXAMPLE BOARD LAYOUT

DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR

LAND PATTERN EXAMPLE SCALE:15X

SOLDER MASK DETAILS

4214838/F 08/2024

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

TEXAS INSTRUMENTS

EXAMPLE STENCIL DESIGN

DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR

PKG └┴ 3X (1.3) ↓ 1 3X (0.6) ↑ SYMM └┴ 2X(0.95) ↑ 3 2 (R0.05) TYP ↗ (2.1)

SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X

4214838/F 08/2024

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
8. Board assembly site may have different recommendations for stencil design.

TEXAS INSTRUMENTS

MECHANICAL DATA

PK (R-PSSO-F3) PLASTIC SINGLE-IN-LINE PACKAGE

4040234/D 02/2006

NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. C. The center lead is in electrical contact with the tab. D. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion not to exceed 0.15 per side. E Thermal pad contour optional within these dimensions. F Falls within JEDEC TO-243 variation AA, except minimum lead length, pin 2 minimum lead width, minimum tab width.

TEXAS INSTRUMENTS

LAND PATTERN

PK (R-PDSO-G3)

NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Publication IPC-7351 is recommended for alternate designs. D. Laser cutting apertures with trapezoidal walls and also rounding corners will offer better paste release. Customers should contact their board assembly site for stencil design recommendations. Refer to IPC-7525. E. Customers should contact their board fabrication site for solder mask tolerances between and around signal pads.

4208221/A 09/06

D0008A

PACKAGE OUTLINE

SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.

TEXAS INSTRUMENTS

EXAMPLE BOARD LAYOUT

D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 ) [1.55]

SYMM

SEE DETAILS

1

8

8X (.024) [0.6]

SYMM

(R.002 ) TYP [0.05]

4

5

6X (.050 ) [1.27]

(.213) [5.4]

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X

METAL

SOLDER MASK OPENING

EXPOSED METAL

• 0028 MAX [0.07] ALL AROUND

NON SOLDER MASK DEFINED

SOLDER MASK OPENING

METAL UNDER SOLDER MASK

EXPOSED METAL

• 0028 MIN [0.07] ALL AROUND

SOLDER MASK DEFINED

SOLDER MASK DETAILS

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

TEXAS INSTRUMENTS

EXAMPLE STENCIL DESIGN

D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 ) [1.55] 1 8X (.024) [0.6] 4 6X (.050 ) [1.27] SYMM ( SYMM ( (R.002 ) TYP [0.05] 8 5 (.213) [5.4]

SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
9. Board assembly site may have different recommendations for stencil design.

TEXAS INSTRUMENTS

MECHANICAL DATA

PS (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE

4040063/C 03/03

NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15.

TEXAS INSTRUMENTS

LAND PATTERN DATA

PS (R-PDSO-G8) PLASTIC SMALL OUTLINE

4212188/A 09/11

NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Publication IPC-7351 is recommended for alternate designs. D. Laser cutting apertures with trapezoidal walls and also rounding corners will offer better paste release. Customers should contact their board assembly site for stencil design recommendations. Refer to IPC-7525 for other stencil recommendations. E. Customers should contact their board fabrication site for solder mask tolerances between and around signal pads.

PACKAGE OUTLINE

LP0003A

TO-92 - 5.34 mm max height

TO-92

FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION

STRAIGHT LEAD OPTION

4215214/C 04/2025

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options.

TEXAS INSTRUMENTS

EXAMPLE BOARD LAYOUT

LP0003A

TO-92 - 5.34 mm max height TO-92

LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X

LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X

4215214/C 04/2025

TAPE SPECIFICATIONS

LP0003A

TO-92 - 5.34 mm max height

TO-92

FOR FORMED LEAD OPTION PACKAGE

4215214/C 04/2025

MECHANICAL DATA

P (R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE

4040082/E 04/2010

NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 variation BA.

TEXAS INSTRUMENTS

PACKAGE OUTLINE

PW0008A

TSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

4221848/A 02/2015

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.

TEXAS INSTRUMENTS

EXAMPLE BOARD LAYOUT

PW0008A

TSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

LAND PATTERN EXAMPLE SCALE:10X

SOLDER MASK DETAILS NOT TO SCALE

4221848/A 02/2015

NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

TEXAS INSTRUMENTS

EXAMPLE STENCIL DESIGN

PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE

4221848/A 02/2015

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
9. Board assembly site may have different recommendations for stencil design.

TEXAS INSTRUMENTS

PACKAGE OUTLINE

DBV0005A

SOT-23 - 1.45 mm max height

SMALL OUTLINE TRANSISTOR

4214839/K 08/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side.
5. Support pin may differ or may not be present.

TEXAS INSTRUMENTS

EXAMPLE BOARD LAYOUT

DBV0005A

SOT-23 - 1.45 mm max height

SMALL OUTLINE TRANSISTOR

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X

SOLDER MASK DETAILS

4214839/K 08/2024

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

TEXAS INSTRUMENTS

EXAMPLE STENCIL DESIGN

DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR

4214839/K 08/2024

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
9. Board assembly site may have different recommendations for stencil design.

TEXAS INSTRUMENTS

PACKAGE OUTLINE

DCK0006A

SOT - 1.1 max height

SMALL OUTLINE TRANSISTOR

2.4 1.8 1.4 1.1 B A PIN 1 INDEX AREA 1 6 4X 0.65 1.3 2 4 3 2.15 1.85 C 0.1 C 1.1 0.8 6X 0.30 0.15 Φ 0.1 M C A B NOTE 5 4X 0° -12° 0.1 TYP 0.0 0.15 GAGE PLANE 4X 4° -15° 0.22 TYP 0.08 8° 0° TYP 0.46 TYP 0.26 SEATING PLANE

4214835/D 11/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Falls within JEDEC MO-203 variation AB.

TEXAS INSTRUMENTS

EXAMPLE BOARD LAYOUT

DCK0006A

SOT - 1.1 max height

SMALL OUTLINE TRANSISTOR

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X

SOLDER MASK DETAILS

4214835/D 11/2024

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

TEXAS INSTRUMENTS

EXAMPLE STENCIL DESIGN

DCK0006A

SOT - 1.1 max height

SMALL OUTLINE TRANSISTOR

4X(0.65) 6X (0.9) PKG 6X (0.4) 1 2 3 (R0.05) TYP 6 SYMM 4 (2.2)

SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:18X

4214835/D 11/2024

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
8. Board assembly site may have different recommendations for stencil design.

TEXAS INSTRUMENTS

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Last updated 10/2025