And dissipation is VERY dependent on what it's mounted to. A multilayer board with ground planes just sucks heat out (just try to solder to a via connected to the ground plane, even with thermal relief). Not to mention (because it's probably not suited for this high frequency application) aluminum core boards.
Best regards, Spehro Pefhany
-- "it's the network..." "The Journey is the reward" speff@interlog.com Info for manufacturers: http://www.trexon.com Embedded software/hardware/analog Info for designers: http://www.speff.com
Yep - totally. Can the OP just measure the temperature by making a phantom? The conduction mechanism dominates, so another way to just avoid this entire problem is to provide plenty of conduction out path...Why borrow trouble when you have that card in your hand? j
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