What happened to natural convection? Even within enclosures this will help to transfer heat through the walls.
Whatever you do, more heatsink surface means more heat extraction from the board.
What happened to natural convection? Even within enclosures this will help to transfer heat through the walls.
Whatever you do, more heatsink surface means more heat extraction from the board.
Call it "More Cowbell".
Maybe if the holes are tiny the solder cannot run thru like a river. Tiny holes if they actually and reliably work that way are nice because one could have a tight array of them with a good packing factor, say approaching 50 percent or better. The solder fill gets rid of most of the air and adds to the overall conductivity. May be a reasonable and (who knows) an optimum solution.
Have something to add? Share your thoughts — no account required.
Ask the community — no account required