Testpoints in production using finepitch/BGA packages (mobile phones etc)

Jan 05, 2007 3 Replies
K

Hi



I am going to investigate if we can get some of the active components cheaper by going from standard packages (SOT-23 etc) to finepitch (SC70, BGA etc) and perhaps also save some space.



I see one problem though. Our production test people like to have a lot of testpoints to do either functional tests (flying probe) or ICT (In Circuit Test - impedance).



But, going to finepitch means we no longer have space for the testpoints - and the production cant measure on the SMD leads/pads.



Today I took two old standard mobile phones and did some reverse engineering. They seem to have very few testpoints. So I wonder - can anyone with experience in high integration devices tell me how they do ICT? Boundary scan or another fancy way?



Thanks



Klaus



PS See picture of the mobile phones here (Nokia 3210 and Siemens



6100):

formatting link



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M

).

Almost certainly JTAG

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P

Probably boundary scan, although some devices have a NAND chain internally for testing too.

Cheers

PeteS

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K

Ok - so the next question:

For analog stuff with high integration, do you place testpoints to be able to find any failed part in the ICT test (almost all nodes needs to be testpoints) - or do you rely on vision systems, functional tests or another method?

Regards

Klaus

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