I have a fast differential 2.5 volt PECL signal pair driving about 6 inches of 100 ohm differential microstrip, on the bottom of a 10-layer board, end terminated with a couple of 50 ohm resistors to ground.
At five places along the way, I via up to the topside to line receivers. I am concerned about how the loading of the vias and receiver chips affects signal integrity along the way.
I'm thinking about simulating each segment as a short 100 ohm txline in LT Spice, and adding the lumped capacitances along the way. I can use Saturn to estimate via capacitance, and I guess measure the capacitance of the line receiver chips. We might add some cutouts to planes or something if that helps.
Maybe there is an IBIS model of these parts somewhere, that we could convert into a basic Spice model of the receivers. We could measure pad and via capacitances on a similar board as sanity checks.
This all seems primitive. What other tools do people use to evaluate signal integrity in situations like this?