IEEE ISQED08 FINAL CALL FOR PAPERS

FINAL CALL FOR PAPERS ISQED 2008 International Symposium and Exhibits in Quality Electronic Design Leading Design for Quality & Manufacturability

Paper Submission Deadline: October 29, 2007 Acceptance Notifications: November 23, 2007 Final Camera-Ready paper: January 3, 2008

The International Symposium on Quality Electronic Design (ISQED) is a premier Design & Design Automation conference, aimed at bridging the gap between and integration of, electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality. ISQED is the pioneer and leading international conference dealing with the design for manufacturability and quality issues front-to-back. ISQED spans three days, Monday through Wednesday, in three parallel tracks, hosting near 100 technical presentations, several keynote speakers panel discussions, workshops /tutorials and other informal meetings. Conference proceedings are published by IEEE and hosted in the digital library. Proceedings CD ROMs are published by ACM. In addition, continuing the tradition of reaching a wider readership in the IC design community, ISQED will continue to publish special issues in leading journals. The authors of high quality papers will be invited to submit an extended version of their papers for the special journal issues.

Papers are requested in the following areas:

A pioneer and leading multidisciplinary conference, ISQED accepts and promotes papers related to the manufacturing, VLSI design and EDA. Authors are invited to submit papers in the various disciplines of high level design, circuit design, test & verification, design automation tools; processes; flows, device modeling, semiconductor technology, and advance packaging.

1. Manufacturing, Semiconductor Process and Devices 1.1 Design for Manufacturability/Yield & Quality (DFM/DFY/DFQ) 1.2 Effects of Technology on IC Design, Performance, Reliability, and Yield (TRD)

1. Design 2.1 System-level Design, Methodologies & Tools (SDM) 2.2 Package - Design Interactions & Co-Design (PDI) 2.3 Robust & Power-conscious Devices, Interconnects, and Circuits (PCC) 2.4 Emerging/Innovative Process & Device Technologies and Design Issues (EDT) 2.5 Design of Reliable Circuits and Systems (DFR)

1. EDA/CAD 3.1 EDA Methodologies, Tools, Flows & IP Cores; Interoperability and Reuse (EDA) 3.2 Design Verification and Design for Testability (DVFT) 3.3 Physical Design, Methodologies & Tools (PDM)

The details of various topics of paper submission is as follows:

Submission of Papers Paper submission must be done on-line via the conference web site at

Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 6 pages) along with an abstract of about 200 words. Please check the as-printed appearance of your paper before uploading. To permit a blind review, do not include name(s) or affiliation(s) of the author(s) on the manuscript and abstract. The complete contact author information needs to be entered separately. The guidelines for the final paper format are provided on the conference web site at Authors of the submitted papers must register and attend the conference for their paper to be published.