Ricky snipped-for-privacy@gmail.com wrote in news: snipped-for-privacy@googlegroups.com:
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Blame RoHS. They disrupted the entire industry. Metallic based lead is not an environmental hazard. Otherwise the water tables around gun ranges (and land fills) would all be overtly contaminated and they are not.
These are typical problems associated with lead free reflow soldering, which requires higher temperatures, but faster ovens to keep the thermal introduction into the parts low. Caused problems for the polymers the industry uses as well. Some no longer work well, some no way.
If the ovens get set too fast a solder joint can appear to be good, but not be in actuality. And the acceptance standards allow a grainy look to be a pass as well. Both things I do not like to see, and this is one very good example of why.
We do not see any mobo makers running their ovens too fast.
A tray full of these cheap things though can endure higher fail rates both at the factory and in the field, so they crank the ovens up to increse output and thus profit from the contractor.
Also, paste has an aging time limit both for exposed time in use and overall expiration time even in storage. So if the paste is out too long, flux based reflow failure can mount (or fail to mount).