I read a paper a while back on this phenomenon applied to TO-247. IEEE trans. power electronics IIRC.
its a huge issue with DCB IGBT modules, and one of the reasons big thyristors are all press-pack.
the junction always heats up faster than the case, thats what causes the problem.
lets look at the model for the infineon SPP04N60C3.
Rth Cth Tau
0.039 0.00007347 2.86us this is the junction 0.074 0.0002831 21us 0.132 0.0004062 54us 0.555 0.001215 674us 0.529 0.00276 1.46ms 0.169 0.029 4.9msso the junction thermal time constant is an order of magnitude smaller than the next quickest one, and > 1000x slower than the tab....
one of the fun things you can do with repetitive overloads is ratchet Tj up while the tab stays fairly cool.
I dont know how applicable those curves are to TO-220/TO-247, but the general argument is a mechanical one, so the trend will be similar.
I stick to a few simple rules, and have very little trouble (and I've built some BIG smps)
- solid 0V plane, no slots
- nice low impedances everywhere
- lots of UVLO-type circuitry, to ensure power-up and power-down is fully controlled (lots of nasties happen with wobbly supplies)
- keep my H fields contained (eg magnetics)
- try to avoid huge E-field radiators
no worries mate :)
LTSPICE, from linear technology. free, powerful, and a plethora of skilled users haunt SED. draw your RC circuit, set up the pulse characteristics of your current source and off you go.
I've done quite a few electro-thermal simulations. Infineon (IIRC) have FET models with a Tj input (Rdson varies with Tj) so your spice circuit model can measure Pfet, run it throu the actual thermal model to calculate Tj, and feed that back into the FET model.... great stuff.
Cheers Terry