I don't tear down many consumer products (when they break, just throw them away) but it seems like COB (chip-on-board) construction isn't common any more. Did it go away, like cordwood?
John Larkin Highland Tech Glen Canyon Design Center Lunatic Fringe Electronics
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It's going gangbusters in LED lighting applications. But it looks like it may be losing out to FlipChip in the emerging super-miniaturized and high density embedded systems, although it's still frequently used.
CAGR: Compound Annual Growth Rate
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john larkin
Right, LEDs are often wire-bonded to a pcb or to an aluminum thing with a thin white insulated coating.
Serious chips seem to be going to leadless packages and BGAs.
COBs don't look repairable to me, so a dense board might have bad yields with COB. Cordwood had the same problem.
We use some tiny unpackaged BGA GaN fets and glob-top them after assembly. We install them on small mouse-bite pcb subassemblies so we can replace them if a GaN fet fails.
I wonder what the first-pass yield is on cell phone boards, and if they are repaired or tossed.
AI Overview
Typical first-pass yield (FPY) for consumer electronics and standard PC board manufacturing generally ranges from 95% to 99% at individual steps or well-managed production lines. However, because smartphone circuit boards feature high component density, complex multi-step processes (component placement, reflow soldering, screen/housing assembly, and testing), the overall Rolled Throughput Yield (RTY) across all sequential operations is lower, often landing closer to 80% to 85% before rework.
John Larkin Highland Tech Glen Canyon Design Center Lunatic Fringe Electronics
J
Jeff Liebermann
In the distant past (approx 2005 - 2010), I helped maintain a few mountain top weather stations. Most of the hardware was cheap consumer grade products from La Crosse which used COB construction and phenolic PCB's:
"Teardown: Zapped weather station"
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Notice the number stations and sensors that use COB construction:
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Touch the epoxy blob and the IC wire bond breaks. Put it in a condensing atmosphere and water damage kills the chip after about a year. No conformal coating. Thermal cycle the COB, and the chip flakes off the PCB.
I haven't done anything with cheap consumer grade weather stations since Covid (about 2019). It's possible that La Crosse and Oregon Scientific have improved their acts, but I really don't know. My guess(tm) is that COB is slowly disappearing, but is not yet extinct.
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