Texas Instruments LM339 datasheet

LM339B, LM2901B, LM339, LM239, LM139, LM2901 Quad Differential Comparators

1 Features

• NEW LM339B and LM2901B
• Improved specifications of B-version
  • Maximum rating: up to 38V
  • ESD rating (HBM): 2kV
  • Low input offset: 0.37mV
  • Low input bias current: 3.5nA
  • Low supply-current: 200μA per comparator
  • Faster response time of 1μsec
  • Extended temperature range for LM339B
• B-version is drop-in replacement for LM239, LM339 and LM2901, A and V versions
• Common-mode input voltage range includes ground
• Differential input voltage range equal to maximum-rated supply voltage: ±38V
• Low output saturation voltage
• Output compatible with TTL, MOS, and CMOS
• For single version, see the TL331B
• For dual version, see the LM393B or LM2903B

2 Applications

• Vacuum robot
• Single phase UPS
• Server PSU
• Cordless power tool
• Wireless infrastructure
• Appliances
• Building automation
• Factory automation & control
• Motor drives
• Infotainment & cluster

3 Description

The LM339B and LM2901B devices are the next generation versions of the industry-standard LM339 and LM2901 comparator family. These next generation B-version comparators feature lower offset voltage, higher supply voltage capability, lower supply current, lower input bias current, lower propagation delay, and improved 2 kV ESD performance and input ruggedness through dedicated ESD clamps. The LM339B and LM2901B can drop-in replace the LM239, LM339 and LM2901, for both "A" and "V" grades.

All devices consist of four independent voltage comparators that are designed to operate from a single power supply over a wide range of voltages. Quiescent current is independent of the supply voltage.

Device Information

(1) For all available packages, see the orderable addendum at the end of the data sheet.

Family Comparison Table

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.

Table of Contents

• 1 Features ........ 1
• 2 Applications ........ 1
• 3 Description ........ 1
• 4 Other Versions ........ 3
• 5 Pin Configuration and Functions ........ 4
• 6 Specifications ........ 5  6.1 Absolute Maximum Ratings for LM339B and
• LM2901B ........ 5
• 6.2 Absolute Maximum Ratings for Non-B Versions ........ 5
• 6.3 ESD Ratings ........ 6  6.4 Recommended Operating Conditions for
• LM339B and LM2901B ........ 6  6.5 Recommended Operating Conditions, Non-B
• Versions ........ 6
• 6.6 Thermal Information ........ 6
• 6.7 Electrical Characteristics for LM339B ........ 7
• 6.8 Electrical Characteristics for LM2901B ........ 8
• 6.9 Electrical Characteristics for LM139 and LM139A ........ 9
• 6.10 Electrical Characteristics for LMx39 and LMx39A ........ 10  6.11 Electrical Characteristics for LM2901,
• LM2901V and LM2901AV ........ 11  6.12 Switching Characteristics for LM139 and
• LM139A ........ 12  6.13 Switching Characteristics for LM339B and
• LM2901B ........ 12
• 6.14 Switching Characteristics for LMx39 and LMx39A ........ 12
• 6.15 Switching Characteristics for LM2901 ........ 12
• 6.16 Typical Characteristics ........ 13
• 7 Detailed Description ........ 19
• 7.1 Overview ........ 19
• 7.2 Functional Block Diagram ........ 19
• 7.3 Feature Description ........ 19
• 7.4 Device Functional Modes ........ 19
• 8 Application and Implementation ........ 20
• 8.1 Application Information ........ 20
• 8.2 Typical Application ........ 20
• 8.3 Power Supply Recommendations ........ 22
• 8.4 Layout ........ 22
• 9 Device and Documentation Support ........ 23
• 9.1 Related Links ........ 23
• 9.2 Receiving Notification of Documentation Updates ........ 23
• 9.3 Support Resources ........ 23
• 9.4 Trademarks ........ 23
• 9.5 Electrostatic Discharge Caution ........ 23
• 9.6 Glossary ........ 23
• 10 Revision History ........ 24 11 Mechanical, Packaging, and Orderable
• Information ........ 26

2 Submit Document Feedback
Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

4 Other Versions

OTHER QUALIFIED VERSIONS OF LM139-SP, LM239A, LM2901, LM2901AV, LM2901V:

• Automotive Q100: LM239A-Q1, LM2901B-Q1, LM2901-Q1, LM2901AV-Q1, LM2901V-Q1
• Enhanced Product: LM239A-EP
• Space: LM139-SP

5 Pin Configuration and Functions

Figure 5-1. D, DB, N, NS, PW Packages 14-Pin SOIC, SSOP, PDIP, SOP, TSSOP Top View

Figure 5-2. RTE Package 16-Pad WQFN With Exposed Thermal Pad Top View

NOTE: Connect exposed thermal pad directly to GND pin.

Table 5-1. Pin Functions

(1) Some manufacturers transpose the names of channels 1 & 2. Electrically the pinouts are identical, just a difference in the channel naming convention.

4 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

6 Specifications

6.1 Absolute Maximum Ratings for LM339B and LM2901B

over operating free-air temperature range (unless otherwise noted)(1)

(1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.

(2) Differential voltages are at IN+ with respect to IN-

(3) Short circuits from outputs to V+ can cause excessive heating and eventual destruction.

6.2 Absolute Maximum Ratings for Non-B Versions

over operating free-air temperature range (unless otherwise noted)(1)

(1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.

(2) All voltage values, except differential voltages, are with respect to network ground.

(3) Differential voltages are at xIN+ with respect to xIN-.

(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.

(5) Input current flows through parasitic diode to ground and can turn on parasitic transistors that can increase ICC and can cause output to be incorrect. Normal operation resumes when the input is removed.

6.3 ESD Ratings

(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process

6.4 Recommended Operating Conditions for LM339B and LM2901B

over operating free-air temperature range (unless otherwise noted)

6.5 Recommended Operating Conditions, Non-B Versions

over operating free-air temperature range (unless otherwise noted)

6.6 Thermal Information

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report, SPRA953.

6 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

6.7 Electrical Characteristics for LM339B

VS = 5V, VCM = (V−) ; TA = 25°C (unless otherwise noted).

(1) When the voltage at either input goes negative by more than 0.3V, the output can be incorrect and excessive input current can flow. The upper end of the common-mode voltage range is limited by VCC − 2V. However only one input needs to be in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state. Either or both inputs can go to maximum VCC level without damage.

6.8 Electrical Characteristics for LM2901B

VS = 5V, VCM = (V−) ; TA = 25°C (unless otherwise noted).

(1) When the voltage at either input goes negative by more than 0.3V, the output can be incorrect and excessive input current can flow. The upper end of the common-mode voltage range is limited by VCC − 2V. However only one input needs to be in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state. Either or both inputs can go to maximum VCC level without damage.

8 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

6.9 Electrical Characteristics for LM139 and LM139A

at specified free-air temperature, VCC = 5V (unless otherwise noted)

(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.

(2) Full range (MIN to MAX) for LM139 and LM139A is –55°C to +125°C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified.

(3) The voltage at either input or common-mode must not be allowed to go negative by more than 0.3V. The upper end of the common-mode voltage range is VCC+ – 1.5V; however, one input can exceed VCC, and the comparator provides a proper output state as long as the other input remains in the common-mode range. Either or both inputs can go to 30V without damage.

6.10 Electrical Characteristics for LMx39 and LMx39A

at specified free-air temperature, VCC = 5V (unless otherwise noted)

(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.

(2) Full range (MIN to MAX) for LM239/LM239A is –25°C to +85°C, and for LM339/LM339A is 0°C to 70°C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified.

(3) The voltage at either input or common-mode must not be allowed to go negative by more than 0.3V. The upper end of the common-mode voltage range is VCC+ – 1.5V; however, one input can exceed VCC, and the comparator provides a proper output state as long as the other input remains in the common-mode range. Either or both inputs can go to 30V without damage.

10 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

6.11 Electrical Characteristics for LM2901, LM2901V and LM2901AV

at specified free-air temperature, VCC = 5V (unless otherwise noted)

(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.

(2) Full range (MIN to MAX) for LM2901 is –□□°C to +125°C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified.

(3) VCC MAX = 30V for non-V devices, and 32V for V-suffix devices

(4) The voltage at either input or common-mode must not be allowed to go negative by more than 0.3V. The upper end of the common-mode voltage range is VCC+ – 1.5V; however, one input can exceed VCC, and the comparator provides a proper output state as long as the other input remains in the common-mode range. Either or both inputs can go to VCC MAX without damage.

6.12 Switching Characteristics for LM139 and LM139A

VCC = 5V, TA = 25°C

(1) CL includes probe and jig capacitance. (2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4V.

6.13 Switching Characteristics for LM339B and LM2901B

VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1kOhm, TA = 25°C (unless otherwise noted).

(1) High-to-low and low-to-high refers to the transition at the input.

6.14 Switching Characteristics for LMx39 and LMx39A

VCC = 5V, TA = 25°C

(1) CL includes probe and jig capacitance. (2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4V.

6.15 Switching Characteristics for LM2901

VCC = 5V, TA = 25°C

(1) CL includes probe and jig capacitance. (2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4V.

12 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

6.16 Typical Characteristics

TA = □□°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted.

Figure 6-1. Total Supply Current vs. Supply Voltage

Figure 6-2. Total Supply Current vs. Input Voltage at 3V

Figure 6-3. Total Supply Current vs. Input Voltage at 3.3V

Figure 6-4. Total Supply Current vs. Input Voltage at 5V

Figure 6-5. Total Supply Current vs. Input Voltage at 12V

Figure 6-6. Total Supply Current vs. Input Voltage at 36V

6.16 Typical Characteristics (continued)

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted.

Figure 6-7. Input Offset Voltage vs. Temperature at 3V

Figure 6-8. Input Offset Voltage vs. Temperature at 5V

Figure 6-9. Input Offset Voltage vs. Temperature at 12V

Figure 6-10. Input Offset Voltage vs. Temperature at 36V

Figure 6-11. Input Offset Voltage vs. Supply Voltage at -40°C

Figure 6-12. Input Offset Voltage vs. Supply Voltage at 25°C

14 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

6.16 Typical Characteristics (continued)

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted.

Figure 6-13. Input Offset Voltage vs. Supply Voltage at 85°C

Figure 6-14. Input Offset Voltage vs. Supply Voltage at 125°C

Figure 6-15. Input Bias Current vs. Supply Voltage

Figure 6-16. Input Bias Current vs. Input Voltage at 5V

Figure 6-17. Input Bias Current vs. Input Voltage at 12V

Figure 6-18. Input Bias Current vs. Input Voltage at 36V

6.16 Typical Characteristics (continued)

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted.

Figure 6-19. Output Low Voltage vs. Output Sinking Current at 3V

Figure 6-20. Output Low Voltage vs. Output Sinking Current at 5V

Figure 6-21. Output Low Voltage vs. Output Sinking Current at 12V

Figure 6-22. Output Low Voltage vs. Output Sinking Current at 36V

Figure 6-23. Output High Leakage Current vs. Temperature at 5V

Figure 6-24. Output High Leakage Current vs. Temperature at 36V

16 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

6.16 Typical Characteristics (continued)

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted.

Figure 6-25. High to Low Propagation Delay vs. Input Overdrive Voltage, 5V

Figure 6-26. Low to High Propagation Delay vs. Input Overdrive Voltage, 5V

Figure 6-27. High to Low Propagation Delay vs. Input Overdrive Voltage, 12V

Figure 6-28. Low to High Propagation Delay vs. Input Overdrive Voltage, 12V

Figure 6-29. High to Low Propagation Delay vs. Input Overdrive Voltage, 36V

Figure 6-30. Low to High Propagation Delay vs. Input Overdrive Voltage, 36V

6.16 Typical Characteristics (continued)

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted.

Figure 6-31. Response Time for Various Overdrives, High-to-Low Transition

Figure 6-32. Response Time for Various Overdrives, Low-to-High Transition

18 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

7 Detailed Description

7.1 Overview

These dual comparators have the ability to operate up to absolute maximum of 36V (38V for the "B" version) on the supply pin. This device has proven ubiquity and versatility across a wide range of applications. This is due to very wide supply voltages range, low Iq and fast response of the devices.

The open-collector outputs allow the user to level shift to the desired logic level indpendent of VCC, while also enabling AND functionality when multiple outputs are connected together.

7.2 Functional Block Diagram

Figure 7-1. Schematic (Each Comparator)

7.3 Feature Description

The comparator consists of a PNP Darlington pair input, allowing the device to operate with very high gain and fast response with minimal input bias current. The input Darlington pair creates a limit on the input common mode voltage capability, allowing the comparator to accurately function from ground to V_CC- 2V over temperature. A clamp is added around Q3 to mimic the both inputs above input voltage range behavior of the original classic silicon.

The output consists of an open drain NPN (pull-down or low side) transistor. The output NPN sinks current when the negative input voltage is higher than the positive input voltage and the offset voltage. The $V_{OL}$ is resistive and scales with the output current. Please see the "Output Low Voltage vs. Output Sinking Current" graphs for $V_{OL}$ values with respect to the output current.

7.4 Device Functional Modes

7.4.1 Voltage Comparison

The comparator operates solely as a voltage comparator, comparing the differential voltage between the positive and negative pins and outputting a logic low or high impedance (logic high with pullup) based on the input differential polarity.

8 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

8.1 Application Information

Typically, a comparator compares either a single signal to a reference, or to two different signals. Many users take advantage of the open-drain output to drive the comparison logic output to a logic voltage level to an MCU or logic device. The wide supply range and high voltage capability makes LMx39 or LM2901x an excellent choice for level shifting to a higher or lower voltage.

8.2 Typical Application

Figure 8-1. Single-ended and Differential Comparator Configurations

8.2.1 Design Requirements

For this design example, use the parameters listed in Table 8-1 as the input parameters.

Table 8-1. Design Parameters

8.2.2 Detailed Design Procedure

When using the LMx39 in a general comparator application, determine the following:

• Input voltage range
• Minimum overdrive voltage
• Output and drive current
• Response time

8.2.2.1 Input Voltage Range

When choosing the input voltage range, the input common mode voltage range (VICR) must be taken in to account. If temperature operation is below 25°C the VICR can range from 0V to VCC– 2.0V. This limits the input voltage range to as high as VCC– 2.0V and as low as 0V. Operation outside of this range can yield incorrect comparisons.

20 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

LM139, LM239, LM339, LM339B, LM139A, LM239A

LM339A, LM2901B, LM2901, LM2901AV, LM2901V

The following is a list of input voltage situation and the outcomes:

1. When both IN- and IN+ are both within the common-mode range: a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not conducting
2. When IN- is higher than common-mode and IN+ is within common-mode, the output is low and the output transistor is sinking current
3. When IN+ is higher than common-mode and IN- is within common-mode, the output is high impedance and the output transistor is not conducting
4. When IN- and IN+ are both higher than common-mode, see Section 2 of Application Design Guidelines for LM339, LM393, TL331 Family Comparators Including the New B-versions.

8.2.2.2 Minimum Overdrive Voltage

Overdrive voltage is the differential voltage produced between the positive and negative inputs of the comparator over the offset voltage (VIO). To make an accurate comparison, the overdrive voltage (VOD) must be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of the comparator, with the response time decreasing with increasing overdrive. Figure 8-2 and Figure 8-3 show positive and negative response times with respect to overdrive voltage.

8.2.2.3 Output and Drive Current

Output current is determined by the load and pullup resistance and logic and pullup voltage. The output current produces a low-level output voltage (VOL) from the comparator, where VOL is proportional to the output current.

The output current can also effect the transient response.

8.2.2.4 Response Time

Response time is a function of input over-drive. See the Typical Characteristics graphs for typical response times. The rise and fall times can be determined by the load capacitance (CL), load/pull-up resistance (RPULLUP) and equivalent collector-emitter resistance (RCE).

• The rise time (tR) is approximately tR = RPULLUP × CL
• The fall time (tF) is approximately tF = RCE × CL
  • RCE can be determined by taking the slope of Figure 6-31 in the linear region at the desired temperature, or by dividing the VOL by IOUT

Submit Document Feedback 21 Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

8.2.3 Application Curves

Figure 8-2 and Figure 8-3 were generated with scope probe parasitic capacitance of 50pF.

Figure 8-2. Response Time vs Output Voltage (Positive Transition)

Figure 8-3. Response Time vs Output Voltage (Negative Transition)

8.3 Power Supply Recommendations

For fast response and comparison applications with noisy or AC inputs, use a bypass capacitor on the supply pin to reject any variation on the supply voltage. This variation can affect the common-mode range of the comparator input and create an inaccurate comparison.

8.4 Layout

8.4.1 Layout Guidelines

For accurate comparator applications without hysteresis maintaining a stable power supply with minimized noise and glitches is critical. Best practice is to add a bypass capacitor between the supply voltage and ground. This can be implemented on the positive power supply and negative supply (if available). If a negative supply is not being used, do not put a capacitor between the GND pin and system ground.

Minimize coupling between outputs and inverting inputs to prevent output oscillations. Do not run output and inverting input traces in parallel unless there is a VCC or GND trace between output and inverting input traces to reduce coupling. When series resistance is added to inputs, place resistor close to the device.

8.4.2 Layout Example

Figure 8-4. LMx39 Layout Example

22 Submit Document Feedback Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

9 Device and Documentation Support

9.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 9-1. Related Links

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision Y (March 2025) to Revision Z (May 2025)

Changes from Revision X (October 2023) to Revision Y (March 2025)

Changes from Revision W (October 2023) to Revision X (October 2023)

Changes from Revision V (December 2022) to Revision W (October 2023)

Changes from Revision U (November 2018) to Revision V (December 2022)

Changes from Revision T (June 2015) to Revision U (November 2018)

24 Submit Document Feedback
Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

Changes from Revision S (August 2012) to Revision T (June 2015)

• Deleted Ordering Information table. ........ 1
• Added Military Disclaimer to Features list. ........ 1
• Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. No specification changes. ........ 1

Product Folder Links: LM139 LM239 LM339 LM339B LM139A LM239A LM339A LM2901B LM2901 LM2901AV LM2901V

Submit Document Feedback 25

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation.

PACKAGE OPTION ADDENDUM

18-May-2026

PACKAGING INFORMATION

Addendum-Page 1

PACKAGE OPTION ADDENDUM

18-May-2026

Addendum-Page 2

PACKAGE OPTION ADDENDUM

18-May-2026

Addendum-Page 3

PACKAGE OPTION ADDENDUM

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(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

Addendum-Page 4

PACKAGE OPTION ADDENDUM 18-May-2026

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM139, LM239A, LM2901, LM2901AV, LM2901B, LM2901V :

• Automotive : LM239A-Q1, LM2901-Q1, LM2901AV-Q1, LM2901B-Q1, LM2901V-Q1

• Enhanced Product : LM239A-EP

• Space : LM139-SP

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

• Enhanced Product - Supports Defense, Aerospace and Medical Applications

• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 5

PACKAGE MATERIALS INFORMATION

23-Oct-2026

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

*All dimensions are nominal

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

23-Oct-2026

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

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Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION

23-Oct-2026

TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

Pack Materials-Page 4

PACKAGE MATERIALS INFORMATION

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Pack Materials-Page 5

PACKAGE MATERIALS INFORMATION

23-Oct-2026

Pack Materials-Page 6

PACKAGE MATERIALS INFORMATION

23-Oct-2026

TUBE

*All dimensions are nominal

Pack Materials-Page 7

GENERIC PACKAGE VIEW

RTE 16

WQFN - 0.8 mm max height

3 x 3, 0.5 mm pitch PLASTIC QUAD FLATPACK - NO LEAD

This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details.

4225944/A TEXAS INSTRUMENTS

PACKAGE OUTLINE

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

EXAMPLE BOARD LAYOUT

RTE0016C

WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X

SOLDER MASK DETAILS

4219117/B 04/2022

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented.

EXAMPLE STENCIL DESIGN

RTE0016C

WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD

4219117/B 04/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

D0014A

PACKAGE OUTLINE

SOIC - 1.75 mm max height

SMALL OUTLINE INTEGRATED CIRCUIT

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.
5. Reference JEDEC registration MS-012, variation AB.

EXAMPLE BOARD LAYOUT

D0014A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT

LAND PATTERN EXAMPLE SCALE:8X

SOLDER MASK DETAILS

4220718/A 09/2016

NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

EXAMPLE STENCIL DESIGN

D0014A SOIC - 1.75 mm max height

SMALL OUTLINE INTEGRATED CIRCUIT

14X (1.55) 1 14X (0.6) 12X (1.27) SYMM 14 SYMM 7 8 (5.4)

SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:8X

4220718/A 09/2016

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
9. Board assembly site may have different recommendations for stencil design.

MECHANICAL DATA

NS (R-PDSO-G**)

14-PINS SHOWN

PLASTIC SMALL-OUTLINE PACKAGE

4040062/C 03/03

NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15.

PACKAGE OUTLINE

DB0014A

SSOP - 2 mm max height

SMALL OUTLINE PACKAGE

8,2 TYP 7,4 PIN 1 INDEX AREA 1 14 6,5 5,9 NOTE 3 7 8 12X 0.65 2X 3.9 14X 0.38 0.22 ⌖ 0.15M C A B 5.6 5.0 NOTE 4 C ⌒ 0.1 C SEATING PLANE B 0.25 0.09 SEE DETAIL A 0.25 GAGE PLANE 0°-8° 0.95 0.55 2 MAX 0.05 MIN DETAIL A TYPICAL

4220762/A 05/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.
4. Reference JEDEC registration MO-150.

EXAMPLE BOARD LAYOUT

DB0014A SSOP - 2 mm max height SMALL OUTLINE PACKAGE

14X (1.85) SYMM (R0.05) TYP 14X (0.45) 1 14 SYMM 12X (0.65) 7 8 (7)

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X

SOLDER MASK OPENING METAL EXPOSED METAL 0.05 MAX ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED)

METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL 0.05 MIN ALL AROUND SOLDER MASK DEFINED

SOLDER MASK DETAILS

4220762/A 05/2024

NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

TEXAS INSTRUMENTS

EXAMPLE STENCIL DESIGN

DB0014A SSOP - 2 mm max height SMALL OUTLINE PACKAGE

4220762/A 05/2024

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
8. Board assembly site may have different recommendations for stencil design.

MECHANICAL DATA

N (R-PDIP-T**)

16 PINS SHOWN

PLASTIC DUAL-IN-LINE PACKAGE

NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. △C Falls within JEDEC MS-001, except 18 and 20 pin minimum body length (Dim A). △D The 20 pin end lead shoulder width is a vendor option, either half or full width.

4040049/E 12/2002

PACKAGE OUTLINE

PW0014A

TSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

6.6 TYP 6.2 PIN 1 INDEX AREA 14 12X 0.65 2X 3.9 14X 0.30 0.17 ⊕ 0.1 M C A B SEATING PLANE C 0.1 C 4X (0° -12°) 1.2 MAX 5.1 4.9 NOTE 3 7 8 4.5 4.3 NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.05 0.75 0.50 0°-8° DETAIL A TYPICAL 4220202/B 12/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

EXAMPLE BOARD LAYOUT

PW0014A

TSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X

SOLDER MASK DETAILS

4220202/B 12/2023

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

EXAMPLE STENCIL DESIGN

PW0014A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE

4220202/B 12/2023

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
9. Board assembly site may have different recommendations for stencil design.

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