This new 3D chip could break AI’s biggest bottleneck Date: December 24, 2025 Source: Stanford University Summary: Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, this approach avoids the traffic jams that limit today’s AI hardware. The prototype already beats comparable chips by several times, with future versions expected to go much further. Just as important, it was manufactured entirely in a U.S. foundry, showing the technology is ready for real-world production. Link:
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