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New plasma trick could unlock smaller, more powerful computer chips A clever chemical trick may help unlock the next era of tiny, high-performance computer chips by peeling away atoms with unprecedented precision. Date: June 17, 2026 Source: Princeton University Summary: A new technique could solve one of the biggest challenges in making future computer chips from ultrathin materials. Researchers found that coating molybdenum disulfide with oxygen or fluorine lets manufacturers remove just the top layer of atoms much more safely during plasma processing. The result is a cleaner, more controlled path toward smaller and more capable electronics.