Okay, I just wanted to run an idea past others, in case I'm being dumb... which is entirely possible.
So one of my Pi 3's needs to be silent due to location, but it's current copper heat sink for the CPU just ain't up to the task of keeping it from heating up too much.
But the current heat sink is pretty tightly bonded to the CPU due to some unusually aggressive thermal adhesive tape. I know I could start slopping alcohol about, but that would require disassembly of the case to avoid cosmetic damage to other elements, and for reason's I won't bore you with, that's not a task I wish to undertake, if I can avoid it.
The one ease of access consideration this case does have, is a nice big hole for air flow, right above the CPU. And that leads me to my possibly dumb idea: can I aid heat dissipation by simply stick another, better heat sink right on top of the existing one with it's flat topped short fins? Sure it'll only contact about 40% of the existing heat sink via the flat tops of it's stubby little fins, but won't it be a decent increase in heat dissipation, nonetheless, especially if I use a tall second heat sink that pokes out the top of the cooling hole?
Or is there some daft flaw in my thinking?
And if this would be sensible, how to you reckon I ought to affix the second heat sink? I could just use more thermal tape, but I don't want dust to sick and clog around the gaps between the fins of the existing heat sink and the sticky bottom of the top heat sink. At least I assume that'd happen. Goodness knows dust gets everywhere else in my home... heh.
TIA :-)