Peter Alfke ( snipped-for-privacy@sbcglobal.net) wrote: : Eric, why do you want to use many small FPGAs in bad packages, when you : could reduce your device count by a factor 8 and use a package that : guarantees better signal integrity?
Peter, Not the OPs reason by the looks of things, but I can see one advantage in more smaller chips over fewer larger chips in the related area.
Modular reconfiguation of number crunching black boxes! The synthesis times for large chip designs tend to be quite at odds with the timescales software people are used to, and pretty much preculde run time modifiable RC acceleration in more than speciallised "We know all options in advance" capacities.
The number of times I've heard different vendors in the area say "... our product converts this number crunching to edif/vhdl/... in seconds. Then we set the Xilinx tools off and go to the pub."
I realise there is support from Xilinx for reconfigurability on a sub chip modular scale, but as I understand it it is reliant on the emulated tristate bus feature lacking in new devices.
I suspect the first vendor to come up with a decent approach for sane HDL
-> Bitstram toolflows on a sub chip modular scale will be very attractive to the HW acceleration / RC folks.
Also I could imagine the reduced PAR etc. times for being able to partition a chip and only re-syn+PAR parts of it would make interactive testing / debugging a lot more of an 'interactive' experience :-)
Finally it would provide people with a way of breaking very very memory hungry PAR runs into more managable (and parallelisable!) jobs. Obviously the module boundries need to be carefully thought out.
Okay I guess the reconfigurable computing world isn't that big for Xilinx sales *yet...*
(This is of my Dear Santa note :-)
Cheers, Chris
: Spartan-3 has lower performance than Virtex-II, and the TQ144 is : probably the worst available package from a signal-integrity point of : view.
: I would use a few Virtex-II devices ( perhaps eight 2V2000 or two : 2V6000 chips), and avoid most of the interconnect hassles that you : mentioned. "Keep most of the routing on chip!" : If this is a university research project, contact Xilinx University : Support. They can be quite helpful... : Peter Alfke, Xilinx Applications
: Eric wrote: : > Hello! I'm trying to build a 20-FPGA (spartan-3s, XC3S400-TQ144s) : board : > for a class project to investigate the use of FPGA arrays for : accelerating : > scientific competition. The idea was to have a 66 MHz 16-bit : > single-ended shared TX bus sending 125 MBps to each FPGA, and a : shared 66 : > MHz 16-bit data aggregation bus where a bus controller would poll : each : > FPGA sequentially to place its output data onto that bus. : >
: > After discussions with some signal-integrity-leery friends, I'm no : longer : > convinced that a 12"x12" 20 IC board at 66 Mhz with single-ended : buses is : > such a good idea. I've been reading the various datasheets on doing : LVDS : > and DDR signaling. Multidrop LVDS is still a bit tricky, evidently, : but to : > cut down on trace number I might be able to go to 125 MHz DDR 4-pair : LVDS : > for the TX bus; the problem I'm having is with the data aggregation : bus. : >
: > Could the aggregate data bus be structured in a similar manner, with: : > a.) all FPGAs connected to the 4 DDR LVDS pairs? : > b.) a single master, with a separate output enable line to each of : the 20 : > FPGAs : >
: > Such that when FPGA n is output-enabled, it would drive it's m : nibbles of : > data onto the output aggregation bus. But this would require FPGA n : to : > drive its pins within 4 ns; this sounds nearly impossible. : >
: > Are there any common solutions I'm missing? One thought was to : aggregate : > all of the data from the FPGAs via dedicated serial links and do : clock : > recovery at the bus master; this would require recovering 20 separate : > clocks, alas, and with the spartan 3s we don't have quite that many : DCMs. : >
: > An obvious solution is "do an IBIS simulation, duh" but we don't : > have access to the sort of high-end signal integrity simulation : software : > that this would require. : >
: > Can anyone with spartan-3 serial interconnect experience offer : > suggestions as to how to make this work, either through different : > LVDS configurations or interconnect topolgies? : > : > Thanks for any advice you : > can give, : > ...Eric