Special session on the 17th Mixdes: High Performance and Embedded Architecture and Compilation

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This year Department of Microelectronics and Computer Science at Technical University of Lodz, Poland

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in collaboration with HiPEAC
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organizes special session during the 17th Mixdes
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conference. The special session: High Performance and Embedded Architecture and Compilation
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is dedicated to cover the activities of HiPEAC, which includes:

  • Multi-core architecture
  • Programming models and operating systems
  • Adaptive compilation
  • Interconnects
  • Reconfigurable computing
  • Design methodology and tools
  • Binary translation and virtualization
  • Simulation platform
  • Compilation platform
  • Mobile platforms and operating systems

Special session will be served by Prof. Rainer Leupers (RWTH Aachen University, HiPEAC steering committee member, Germany) and PhD. Bart=C5=82omiej =C5=9Awiercz (Proximetry Poland sp. z o.o. and Tech. Univ. = Lodz, Poland). The main aim of the conference is to integrate the central and eastern europe community of embedded engineers and researches with HiPEAC organization. This event is planned to be constant part of every Mixdes conference on annual basis. All accepted articles will be published in the conference proceedings.

The MIXDES conference series started in D=C4=99be near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to continue the tradition of inviting you to the most attractive places in Poland and the will take place in Wroc=C5=82aw. The aim of the MIXDES conference is to provide an annual Central- European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices. The MIXDES conference papers are indexed in Thomson Reuters Conference Proceedings Citation Index and available in IEEE Xplore since MIXDES

2005.

The topics of the MIXDES 2010 Conference include:

  1. Design of Integrated Circuits and Microsystems Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.

  1. Thermal Issues in Microelectronics Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.

  2. Analysis and Modelling of ICs and Microsystems Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.

  1. Microelectronics Technology and Packaging New microelectronic technologies. Packaging. Sensors and actuators.

  2. Testing and Reliability Design for testability and manufacturability. Measurement instruments and techniques.

  1. Power Electronics Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.

  2. Signal Processing Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.

  1. Embedded Systems Design, verification and applications.

  2. Medical Applications Medical and biotechnology applications. Thermography in medicine.

The time schedule for paper submission to High Performance and Embedded Architecture and Compilationspecial session is as follows:

- information about article (the title and list of authors): 4.05.2010

- final paper submission: 16.05.2010

- reviewers feedback: 20.05.2010

I am looking forward to meet you in Wroclaw.

Kind regards, Bartlomiej Swiercz snipped-for-privacy@dmcs.pl

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