Does anyone here have suggestions for good ways to remove flat pack ICs on prototype boards such as a 64 pin TQFP or larger?
The tools I have available, have a (smaller) hot air tool that is fine for chip package compoents but can't output enough to do a larger device like an IC larger than an SOIC-16. I have used the Dremel with diamond wheel cutter method sucessfully but it does carry a real risk of ripping pads off the board no matter how carefull you are. These are prototype boards in a development project so their "value" is high in that they would be expensive and time consuming to replace.
I know that there are tools available that will apply the hot air and then apply vacuum pressure to remove the device reliably but I don't have access to that level of equipment.