Chip Packaging Engineer - Toronto

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Hello,

Thinkpath Engineering is a large engineering services company with a 27
year  track record in Engineering and Design services. We are a global
provider of engineering services, design, build, drafting, technical
publishing & documentation and on-site engineering support. Thinkpath
enables corporations to reinvent themselves structurally; drive
strategies of innovation, speed to market, globalization and focus in
new and bold ways. We are experts in the aerospace, automotive,
defense, manufacturing and health care industries. With 6 offices in
Canada and the US, we are always looking for talented people.

We are seeking a Chip Packaging Engineer with at least 5 years of
experience in multi-chip package design. You must have a strong
background in multi chip package design, wire bond assembly,
encapsulation, package stacking, thermal analysis and test. You will be
involved in the research and development of the electrical, thermal and
mechanical design aspects of these new products. You will also help
drive the introduction and realization of these products into a full
scale production environment.

In this role, you will interact with other talented, experienced, and
energetic team members and engage with a wide variety of professional,
top notch external suppliers, subcontractors, and customers. You will
ensure that products are designed in a manner that will result in the
efficient production of high quality products using the most cost
effective designs, materials and manufacturing processes available.

Working in a fast growing, early stage company environment will require
that you be a creative thinker and a resourceful problem solver. You
must be a results-driven, self starter with strong communication and
interpersonal skills who is capable of working both independently and
in a team environment.

You have excellent communication skills and ability to demonstrate
proficiency in AutoCAD software. You  must have a professional
qualification as a Electrical Engineer.  You will benefit by working
with a committed team of professional engineers supported by a
sophisticated infrastructure at Thinkpath. Ideal candidates will
possess a strong and demonstrable design track record in the
electronics industries.


Responsibilities

B7% Develop concepts and define specifications for new multi chip
packages for dense, high speed applications to meet industry and
customer quality standards
B7% Select appropriate materials including those for die attach,
encapsulation, adhesive, and solder paste to achieve the desired
mechanical, electrical, thermal (dissipation and CTE matching), and
reliability properties
B7% Perform thermal modeling, analysis and testing of multi chip
packages
B7% Utilize package characterization techniques and DOE methodology for
development
B7% Design multi chip packages using wire bond assembly and provide
wire bonding diagrams
B7% Source, audit and establish technical relationships with a high
quality vendor manufacturing base
B7% Co-ordinate prototype builds and develop ultimate production level
manufacturing process flow including die attach, wirebonding,
encapsulation, solder bumping, package stacking, and heat sink attach
B7% Assist in test development (test fixtures, programs, analysis,
debug) at chip package level
B7% Implement appropriate quality plans including SPC


Education, Skills and Experience
B7% 5 years minimum in high speed IC packaging
B7% Strong understanding of various Package Interconnect Technologies
and experienced with JEDEC and IPC requirements for electronic
packaging
B7% Must be proficient in advanced packaging technologies including
CSP, QFN, BGA, MCM/MCP, and Package Stacking
B7% Must have experience with wire bond assembly and encapsulation
process and thermal management, modeling and analysis
B7% Must have strong understanding of solder joint reliability
B7% Experience in package level test, data collection, FA and debug
B7% Must be proficient in AutoCAD or equivalent
B7% Must have a BS or MS in Electrical Engineering or Materials Science
equivalent
B7% Experience with the coordination of internal and external resources
B7% Strong written and verbal communication skills required

If you think you are the right candidate for this dynamic opportunity,
please forward your Word resume and a cover letter to Kelsey Jones at
snipped-for-privacy@yahoo.com immediately. This is a long term
contract position. Please provide your contract rate expectations.

We pay referral bonuses to anyone who refers a good candidate that gets
hired for at leat 90 days. If you know anyone who is qualified,  please
email the contact and phone number to Kelsey Jones at
snipped-for-privacy@yahoo.com.


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