I have designed a 6 layer board using a 256 ball Atmel BGA chip (AT91RM9200). It consists of two internal power layers, 2 internal signal layers and two heavily copper filled outer layers with virtually no tracks. The stackup has the Toplayer, Signal layer then Power layers very close together with a 1mm core. I am seeing a high level of failures due to the BGA chip solder balls not melting (Lead free manufacture). My manufacturer tells me that this is because I have a solid ground plane on the two outer layers of the PCB, though not underneath the solder balls on the top outer layer. They state this is a large thermal mass and stopping the bga heating properly. The copper planes are there for good EMC practice so I am loath to remove them, however if this really is the cause of the problem I will have to. Has anybody else come across this problem or can offer any solutions, thanks?
- posted
15 years ago