We have a customer who has added huge amounts of functionality requirements to one of our products, so now we have to replace the FPGAs, going from an Altera Arria II GX45 to the GX65. This is a 760 pin BGA, and we'll have to replace the chips on 25 delivered units. We'll use the cool sticky-down stencil things.
The customer is (for no logical reason) worried about reliability. On all units that are reworked, they want the boards (unpowered) to be temperature cycled and then they want the BGAs xray inspected. And they want us to replace the entire board, at our expense, on any units that don't pass xray inspection.
I've researched the xray thing some, and it seems to be an arbitrary and very imprecise business. As I understand it, production BGA assemblies are seldom xrayed. Our prime contract assembler says "Sure we can xray it for you; we never use the machine."
Our problem is that we don't want to replace an entire board because some black dot looks a little ragged, or a ball seems to have a void. Apparently even unused BGAs, straight from the tube, can show voids, and one study suggests that BGA voids improve reliability.
Any experience with xray inspection of BGAs?