I'm trying to figure out where the not-so-uncommon practice of flooding the top and bottom layers of a four (or greater) layer boards (where the inner layers are power and ground) comes from. I'm often having to get our techs to widen the clearance between the copper pours and controlled impedance traces because they like to set the clearance from the copper pour to the other signal nets so tightly (e.g., 6mils) that they end up turning microstrip lines into coplanar waveguides and significantly altering their impedances. It occurred to me that rather than continually dealing with this (they always use copper pours by default), it might be easier to just tell them not to use a copper pour on the top or bottom layers at all since I can't think of any particularly compelling reasons to do so in the first place (and they say they're doing it by default because it's "common practice" and "their personal preference"). The benefits of a top or bottom layer ground pour on a four-layer board that I can think of are...
-- Certainly you could use it as a nice bit of heatsinking if you have power components elsewhere that connect to the plane layers
-- At low enough frequencies, you probably get slightly better shielding from outside interferers or for crosstalk. At high enough frequencies, this can of course come back and actually create greater interference if you haved "nailed down" (viaed) the copper pour to ground at regular intervals (due to resonances, e.g., an isolated copper pour with no grounding at all looking like a pretty good patch antenna).
Am I missing something here?
---Joel